creat by art - low power loss, high efficiency - ideal for automated placement - guardring for overvoltage protection - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free base p/n with prefix "h" on packing code - aec-q101 qualified terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test with prefix "h" on packing code meet jesd 201 class 2 whisker test v rrm 20 30 40 50 60 90 100 150 v v rms 14 21 28 35 42 63 70 105 v v dc 20 30 40 50 60 90 100 150 v i f(av) a r jc o c/w t j o c t stg o c document number: ds_d1310002 version: k13 15 10 - 55 to +150 storage temperature range - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle typical thermal resistance 1.5 operating junction temperature range maximum reverse current @ rated vr t j =25 t j =100 t j =125 i r ma - -5 0.5 0.1 a maximum instantaneous forward voltage (note 1) i f = 20 a v f 0.57 0.70 v 0.92 1.02 maximum dc blocking voltage maximum average forward rectified current 20 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 330 sras 2090 sras 20100 sras 20150 unit maximum repetitive peak reverse voltage maximum rms voltage polarity: as marked weight: 1.7 g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol sras 2020 sras 2030 sras 2040 sras 2050 sras 2060 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data case: to-263ab (d 2 pak) to-263ab (d 2 pak) sras2020 thru SRAS20150 taiwan semiconductor surface mount schottk y barrier rectifiers features - moisture sensitivity level: level 1, per j-std-020
part no. part no. sras2060 sras2060 sras2060 (ta=25 unless otherwise noted) document number: ds_d1310002 version: k13 sras2020 thru SRAS20150 taiwan semiconductor ordering information aec-q101 qualified packing code green compound code package packing sras20xx (note 1) prefix "h" rn suffix "g" d 2 pak 800 / 13" paper reel c0 d 2 pak 50 / tube note 1: "xx" defines voltage from 20v (sras2020) to 150v (SRAS20150) example preferred p/n aec-q101 qualified packing code green compound code description sras2060 rn rn sras2060 rng rn g green compound sras2060hrn h rn aec-q101 qualified ratings and characteristics curves 0 5 10 15 20 25 50 60 70 80 90 100 110 120 130 140 150 average forward a current (a) case temperature ( o c) fig.1 forward current derating curve resistive or inductiveload 10 100 1000 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2 maximum non-repetitive forward surge current 8.3ms single half sine wave 0.001 0.01 0.1 1 10 0 20 40 60 80 100 120 140 instantaneous reverse current (ma) percent of rated peak reverse voltage (%) fig. 4 typical reverse characteristics tj=25 tj=75 tj=125 0.1 1 10 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 instantaneous forward current (a) forward voltage (v) fig. 3 typical forward characteristics sras2050-60 sras2090-100 SRAS20150 pluse width=300 s 1% duty cycle sras2020-40
min max min max a - 10.5 - 0.413 b 14.60 15.88 0.575 0.625 c 2.41 2.67 0.095 0.105 d 0.68 0.94 0.027 0.037 e 2.29 2.79 0.090 0.110 f 4.44 4.70 0.175 0.185 g 1.14 1.40 0.045 0.055 h 1.14 1.40 0.045 0.055 i 8.25 9.25 0.325 0.364 j 0.36 0.53 0.014 0.021 k 2.03 2.79 0.080 0.110 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1310002 version: k13 sras2020 thru SRAS20150 taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 16.9 suggested pad layout symbol unit (mm) a 10.8 b8.3 unit (inch) 0.425 f9.5 g2.5 marking diagram c1.1 d3.5 e 0.327 0.043 0.138 0.665 0.374 0.098 100 1000 10000 0.1 1 10 100 capacitance (pf) a reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p 0.1 1 10 100 0.01 0.1 1 10 100 transient thermal impedance a ( /w) t-pulse duration(s) fig. 6 typical transient thermal impedance
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1310002 version: k13 sras2020 thru SRAS20150 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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